| 摘要 |
A surface protective film which can be easily peeled off from an adhesive silicone rubber composition layer, is free of a plasticizer or the like which may have an adverse effect on adhesion of the adhesive silicone rubber composition layer to a semiconductor chip or semiconductor chip attaching portion, and has no adverse effect on thickness uniformity or surface flatness of the adhesive silicone rubber composition layer, and a process for producing the same. More specifically, a surface protective film for protecting an adhesive silicone rubber composition layer (C), comprising a base film (A) coated, at least on one side, with a cellulose-based resin layer (B) having an SP value of 21.0 to 29.0(MPa)<1/2>, determined by the Fedors method, and process for producing the same.
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