| 摘要 |
PROBLEM TO BE SOLVED: To remove a part of a sheathing resin of an integrated circuit by a chemical without excess or insufficiency of the sheathing resin at a center, a peripheral part on a surface of an internal integrated circuit chip and a periphery of the chip. SOLUTION: A removing device of the sheathing resin of the integrated circuit component includes a sample base having at least sample supporting function and chemical injecting function, a chemical supply means, a waste liquid recovering means, and a chemical temperature control means. The sheathing resin is removed by dissolving at two stages of different chemical temperatures by at least two of the number of the temperature control means. COPYRIGHT: (C)2004,JPO
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