发明名称 |
Heated substrate support |
摘要 |
Embodiments of the invention generally provide a substrate support for supporting a substrate. In one embodiment, a substrate support is provided that includes a plate assembly having at least a first heating element disposed therein or coupled thereto. A plurality of thermal isolators are disposed through plate assembly, defining a plurality of temperature controllable zones across the plane of the plate assembly.
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申请公布号 |
US2004065656(A1) |
申请公布日期 |
2004.04.08 |
申请号 |
US20020265212 |
申请日期 |
2002.10.04 |
申请人 |
INAGAWA MAKOTO;HOSOKAWA AKIHIRO |
发明人 |
INAGAWA MAKOTO;HOSOKAWA AKIHIRO |
分类号 |
C23C16/458;C23C16/46;H01L21/00;H01L21/687;(IPC1-7):H05B3/68 |
主分类号 |
C23C16/458 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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