| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for encapsulation, free from halogens and antimony and having good flame retardance without lowering the reliability of moldability, reflow resistance, moisture resistance, etc., and provide an electronic device provided with an element encapsulated with the epoxy resin molding material. SOLUTION: The epoxy resin molding material for encapsulation contains (A) an epoxy resin, (B) a curing agent, (C) a cure accelerator, (D) a filler, (E) a coupling agent and (F) a flame retardant as essential components. The weight ratio of the biphenyl-type epoxy resin to the biphenyl-aralkyl-type epoxy resin in the epoxy resin A is 50/50 to 5/95. COPYRIGHT: (C)2004,JPO
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