HEAT-TREATING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a heat-treating apparatus having a substrate support which suppresses a rub between the substrate support body and a substrate to reduce flaws, a slip, and further curvature, and a method for manufacturing a semiconductor device. SOLUTION: The substrate support body 30 has a ring-shaped plate 72 provided to a main body part and a support part 54 is suspended from a cut 74 formed in the plate 72. This support part 54 has a spherical fulcrum 62 and a hook part 64 and freely swings on the plate 72 around the spherical fulcrum 62. The substrate is mounted on the hook part 64 and even if the substrate deforms owing to heat stress, the support part 54 which freely swings can absorb that. COPYRIGHT: (C)2004,JPO