| 摘要 |
Process for the mounting of diodes comprises: preparing a substrate (100), forming grooves (105), filling the grooves with insulation (106), producing a pair of contacts (110AA, 110AB) on the surface, cutting away to expose the lower ends of the grooves, forming a pair of contacts (110B), mounting a reflector frame arrangement (120), inserting LED chips (103), sealing the elements and cutting into individual LED components. Process for the surface mounting of illuminating diodes comprises preparing an electrically and thermally conducting substrate (100), forming grooves (105) in the substrate, filling the grooves with an insulating layer (106), producing a pair of first metal contacts (110AA, 110AB) on the surface of the substrate, cutting away the base layer of the substrate to expose the lower ends of the grooves, forming a pair of second metal contacts (110B) on the base surface, mounting a reflector frame arrangement (120) on the surface, inserting LED chips (103) in the frame, sealing the elements and cutting the substrate into individual LED components. Independent claims are also included for the following: (1) Alternative processes for the surface mounting of illuminating diodes; and (2) Surface-mounted illuminating diode. |
