发明名称 High-density PCB test jack
摘要 A printed-circuit board (PCB) test jack comprises a body portion adapted for mounting on the top surface of a PCB and to provide mechanical support and signal and ground connections to an external test probe. At least one surface mount ground conductor is connected to and extends from the body portion to provide the ground connection; the ground conductors are arrayed for attaching to corresponding surface pads on the PCB's top surface. A single through-hole pin for insertion into a corresponding through-hole on the PCB is electrically isolated from the surface mount ground conductors and is connected to the body portion for providing the signal connection.
申请公布号 US6717425(B2) 申请公布日期 2004.04.06
申请号 US20010982430 申请日期 2001.10.17
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 MCCLURE LINDEN H.;ALLAN SCOTT P.
分类号 G01R31/28;(IPC1-7):G01R31/02;H01R4/02;H05K1/00 主分类号 G01R31/28
代理机构 代理人
主权项
地址