发明名称 Semiconductor inductor and methods for making the same
摘要 A semiconductor inductor and a method for making a semiconductor inductor are provided. An oxide layer disposed over a substrate is etched to form an interconnect metallization trench within the oxide layer. The oxide layer is also etched to form a first inductor trench within the oxide layer such that the first inductor trench is defined in an inductor geometry. The oxide layer is then etched to form at least one via in the interconnect metallization trench and a second inductor trench over the first inductor trench in the oxide layer. The second inductor trench also has the inductor geometry. After the oxide layer is etched, the at least one via, the second inductor trench, the interconnect metallization trench and the first inductor trench are filled with copper. The semiconductor inductor is configured to have a low resistance and a high quality factor.
申请公布号 US6717232(B2) 申请公布日期 2004.04.06
申请号 US20030406914 申请日期 2003.04.02
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 BOTHRA SUBHAS
分类号 H01F17/00;H01F41/04;H01L21/02;H01L21/3205;H01L21/822;H01L23/52;H01L27/04;(IPC1-7):H01L29/00 主分类号 H01F17/00
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