| 摘要 |
A high-density integrated circuit package and a method for the same. The package includes a substrate having a plurality of bump pads and a plurality of conductive lines on the surface, wherein a solder wettable material is on the top surface of each bump pad, a dielectric material is on the top surface of each conductive line for protection, and a solder non-wettable material is formed on the sidewall of each conductive line and each bump pad for protection and avoiding the problem of short circuit, and a chip having a plurality of bumps on a surface corresponding to the bump pads respectively and electric connecting with the bump pads.
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