| 摘要 |
PURPOSE:To provide the title printed wiring board ensuring higher peformances and stabilization while increasing the wiring and mounting density by adopting a relatively simple interlayer connecting constitution. CONSTITUTION:Winthin the title printed wiring board provided with a conductive metallic thin plate 11a, a wiring pattern layer 13 arranged on the conductive thin film surface through the intermediary of an insulating layer 12 and an interlayer connecting part 14 piercing the wiring pattern layer 13 and the conductive metallic thin plate 11a to be connected thereto, the interlayer connecting part 14 is provided at least on either one out of the conductive metallic thin plate surface 11a and the wiring pattern layer 13 side. Furthermore, the printed wiring board is composed by piercing the insulator layer 12 in the pressure integration stage and plastic-deforming in the opposite conductive metallic thin plate surface side or wiring pattern layer 13 surface side to be connected. |
