| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a wiring substrate with no deformation such as a warp at a bonding shelf part when manufacturing the wiring substrate whose ceramic part of the bonding shelf part is thin, among the wiring substrates having a ceramic laminated structure equipped with the bonding shelf part at the inner circumference of a through-hole penetrating vertically. <P>SOLUTION: An unbaked wiring substrate 1 made up of two or more green sheets 1a and 1b is mounted, with its undersurface 3 facing downward, on a flat base surface 51 in a baking oven so that the undersurface 3 comes into contact with the base surface 51. When the substrate is baked, a weight 21 is placed on the top surface of the green sheet 1a at the uppermost layer and at the same time, a weight 11 is placed on top surface of the green sheet 1b making up the bonding shelf part 5 so that both the top surfaces are pressed to the base surface 51 during baking. <P>COPYRIGHT: (C)2004,JPO</p> |
