FLIP CHIP BGA TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enable substrate cleaning to be performed thoroughly so that no fluxing agent used in solder bonding or the like remains as residual dross on a surface of the substrate or on the surfaces of a chip after the chip has been soldered to balls of the substrate in an assembly process of flip chip BGAs.

SOLUTION: There is provided a gap 17 between the substrate 11 and a stiffener 12 at both sides of a chip 14 soldered on the substrate 11 and when cleaning water is made to flow in from one side of the gap 17, maintaining virtually the momentum behind the cleaning water is made to pass through a portion between the chip 14 and the substrate 11 to achieve an increased cleaning effect thereon.

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