| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film stacked electronic component like a thin film stacked capacitor wherein planarity is not damaged even if the number of the laminations is increased largely, so that cracks and electrode shorting are not caused and the reliability is improved, and to provide its manufacturing method. SOLUTION: Firstly, a first conductor thin film 20 is formed on a substrate 6. Secondly, a part of the first conductor thin film 20 is insulated in a thickness direction, and an insulating pattern 44a is formed in the first conductor thin film 20. Thirdly an interlayer insulator film 12 is formed on the first conductor thin film 20 in which the insulating pattern 44a is formed. The respective processes from the first process to the third process are repeated on the interlayer insulator film 12. COPYRIGHT: (C)2004,JPO
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