| 摘要 |
PROBLEM TO BE SOLVED: To improve the wiring efficiency by restraining a pad diameter and, simultaneously, surely mount a surface mount component onto a printed wiring board while mechanically stabilizing. SOLUTION: The surface mount component is mounted on the substrate 10, in which terminals for electrically connecting to a substrate are arranged on one surface of a package with the shape of a matrix, while terminals for mechanically connecting to the substrate are provided at the outside of the matrix. Then, the terminals for electric connection are connected to clearance pads 7 and the terminals for mechanical connection are connected to over-resist pads 8, respectively. A connecting pattern 12 can be extracted out of the inside pads 7a through a space between the clearance pads having a relatively small pad diameter whereby the wiring efficiency is improved. COPYRIGHT: (C)2004,JPO
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