| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition which has excellent solder heat resistance together with good flame retardancy, and to provide a resin-sealed semiconductor device using the same. SOLUTION: The sealing resin composition comprises (A) an epoxy resin containing a component represented by general formula [1], (B) a phenol resin hardener containing a component represented by general formula [2], (C) 1, 8-diazabicyclo[5, 4, 0]undecene-7, (D) an amino-modified polysiloxane and (E) an inorganic filler, providing the resin-sealed semiconductor device using the same (in the formulae, n is 0 or an integer of≥1). COPYRIGHT: (C)2004,JPO
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