| 摘要 |
PROBLEM TO BE SOLVED: To reduce variation of plate thickness of a TFT glass substrate (an array substrate) after polishing. SOLUTION: On a corner part 4 where an X-edge 2 and a Y-edge 3 of the TFT glass substrate 1 intersect each other, a C-chamfering 5 as a chamfer with a specified dimension from an intersection 4a of X-, Y-edges is provided and polishing is carried out while a CF substrate 11 is laminated. By providing the C-chamfering 5, a polishing layer of a lower surface plate 609 is brought into contact with a full surface of the TFT glass substrate 1 with a uniform load. Thereby, when the TFT glass substrate 1 is polished with a polishing device 600, deformation of the corner part 4 generated by making a seal part a fulcrum is diminished. As a result, reduction of polishing amount on a single plate part 1a is prevented. COPYRIGHT: (C)2004,JPO
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