发明名称 PRECURSOR FOR FORMING HAFNIUM OXIDE FILM, METHOD FOR FORMING HAFNIUM OXIDE FILM, CAPACITOR STRUCTURE, TRANSISTOR STRUCTURE, AND ELECTRONIC ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a precursor for forming a hafnium oxide film and a method for forming the hafnium oxide film, using the precursor. <P>SOLUTION: By a precursor for forming a hafnium oxide film, characterized by bonding hafnium tetrachloride with a nitrogen compound, low-temperature evaporation is permitted while the electrical properties are improved. There are obtained the precursor for forming the hafnium oxide film exhibiting improved step coverage, due to improvement in the deposition rate, and a method for forming the hafnium oxide film, using this precursor. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004104111(A) 申请公布日期 2004.04.02
申请号 JP20030292164 申请日期 2003.08.12
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RI SHOKEN;MIN YO-SEP;CHO YOUNG-JIN
分类号 C01G27/02;C01G27/04;C07F7/00;C23C14/08;C23C14/58;C23C16/40;H01L21/28;H01L21/316;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;H01L29/51;H01L29/78 主分类号 C01G27/02
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