发明名称 |
FILM-LIKE LAMINATE AND FLEXIBLE CIRCUIT SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a film-like laminate which can obtain a fine pattern and which has excellent electrical reliability. SOLUTION: The film-like laminate is constituted by sequentially forming a plasma chemical vapor deposition layer of an organic metal compound and a conductor layer on at least one side surface of a heat resistant polymer film. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004098570(A) |
申请公布日期 |
2004.04.02 |
申请号 |
JP20020265862 |
申请日期 |
2002.09.11 |
申请人 |
AMT KENKYUSHO:KK |
发明人 |
WATANABE TAKASHI;SHIMIZU SEIGO |
分类号 |
B32B9/00;B32B15/08;C23C14/34;C23C16/18;C23C16/50;H05K3/38;(IPC1-7):B32B9/00 |
主分类号 |
B32B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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