发明名称 FILM-LIKE LAMINATE AND FLEXIBLE CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a film-like laminate which can obtain a fine pattern and which has excellent electrical reliability. SOLUTION: The film-like laminate is constituted by sequentially forming a plasma chemical vapor deposition layer of an organic metal compound and a conductor layer on at least one side surface of a heat resistant polymer film. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004098570(A) 申请公布日期 2004.04.02
申请号 JP20020265862 申请日期 2002.09.11
申请人 AMT KENKYUSHO:KK 发明人 WATANABE TAKASHI;SHIMIZU SEIGO
分类号 B32B9/00;B32B15/08;C23C14/34;C23C16/18;C23C16/50;H05K3/38;(IPC1-7):B32B9/00 主分类号 B32B9/00
代理机构 代理人
主权项
地址