| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing agent composition for an epoxy compound, which can prevent the settling of an inorganic filler blended with a curing agent comprising an acid anhydride. SOLUTION: The curing agent composition for an epoxy compound consists of a curing agent comprising an acid anhydride for curing an epoxy compound, first particles comprising an inorganic filler, and second particles comprising a spherical inorganic filler, wherein the second particles used comprise a fine particulate spherical alumina having a mean particle diameter of at most 1/500 of the mean particle diameter of the first particles, a fine particulate spherical alumina having a surface treated with a trimethylsilyl group, a fine particulate spherical alumina having a surface treated with a dimethylsilicone oil, or a mixture of a fine particulate spherical alumina and a fine particulate spherical silica having a surface treated with a dimethylsilicone oil. COPYRIGHT: (C)2004,JPO
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