ELECTRONIC COMPONENT, PACKAGING SUBSTRATE OF ELECTRONIC COMPONENT, ELECTRO-OPTICAL DEVICE, ELECTRONIC APPARATUS, AND PRODUCTION OF ELECTRO-OPTICAL DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component having a shape which enables improvement of adhesion between an electronic component packaged by soldering and a packaging substrate. SOLUTION: A packaging process of the electronic component has a process for soldering the electronic component to the substrate by heating solder after the electronic component is mounted on the substrate whereon solder is put. A contact area between the solder and the electronic component can be enlarged by providing recess and projection to a solder fixing part of the electronic component. Consequently, adhesion between the electronic component and the packaging substrate can be improved, thus not only providing a highly reliable packaging substrate and but also enabling use of environment-friendly lead-free solder (solder which does not contain lead), of which adhesion strength is a problem. COPYRIGHT: (C)2004,JPO