| 发明名称 |
INTEGRATED CIRCUIT DIE HAVING AN ELECTROMAGNETIC INTERFERENCE SHIELD |
| 摘要 |
A package for housing a device (e.g., an integrated circuit chip or die) includes a Faraday cage. The Faraday cage is at least partially formed in the integrated circuit die. The die includes conductive vias and solder balls surrounding a circuit. The package can be a ball grid array (BGA) package or flip chip package. The package substrate can include a ground plane. |
| 申请公布号 |
WO02067326(A9) |
申请公布日期 |
2004.04.01 |
| 申请号 |
WO2002US04193 |
申请日期 |
2002.02.13 |
| 申请人 |
ASHVATTHA SEMICONDUCTOR, INC. |
发明人 |
SRIDHARAN, GURUSWAMI, M.;SRIDHARAN, KARTIK, M. |
| 分类号 |
H01L23/12;H01L23/498;H01L23/522;H01L23/552;H01L23/58;H01L23/60 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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