Fabricating complex micro-electromechanical systems using a flip bonding technique

摘要

A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.