发明名称 Optimized contact design for flip-chip LED
摘要 Light emitting diodes are provided with electrode and pad structures that facilitate current spreading and heat sinking. A light emitting diode may be formed as a die with a stacked structure having a first region and a mesa projecting from a surface of the first region. A first electrode may substantially cover the mesa and have a plurality of pads disposed thereon maximizing a contact area in relation to the first electrode. A second electrode may be disposed as a trace on the surface of the first region, the trace having a spiral, segmented/interdigitated, loop or pattern. Optionally, the trace includes corner spikes projecting outwardly toward edges of the first electrode.
申请公布号 US2004061123(A1) 申请公布日期 2004.04.01
申请号 US20020256402 申请日期 2002.09.27
申请人 EMCORE CORPORATION 发明人 SHELTON BRYAN;ELIASHEVICH IVAN;VENUGOPALAN HARI
分类号 H01L33/20;H01L33/38;(IPC1-7):H01L33/00 主分类号 H01L33/20
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