发明名称 |
Bonding method, bonding stage and electronic component packaging apparatus |
摘要 |
A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.
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申请公布号 |
US2004063251(A1) |
申请公布日期 |
2004.04.01 |
申请号 |
US20030668483 |
申请日期 |
2003.09.22 |
申请人 |
SUMITOMO OSAKA CEMENT CO., LTD. |
发明人 |
OOTSUKA TAKESHI;KOSAKAI MAMORU |
分类号 |
H01L21/44;H01L21/60;H01L21/607;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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