| 摘要 |
<p>This invention describes fabrication techniques for producing microdisplays suitable for combining into tiled, flat-panel displays having visually imperceptible seams. Assembly techniques to overcome flatness requirements imposed by tiled, flat-panel display assemblies include the steps of process micro-diaply wafer to mirror level (200), separate tiles and precision finish edges (202), assembly tile array on carrier and polish backside (204), backfill seams and apply backside light shields (206), attach to common substrate and release top side carrier (208), polish front side of the tile array (210), complete fabrication front side of tiled panel (212) and assembly complete microdisplay unit (214) as described. The use of these inventive techniques allows the assembly microdisplays into tiled, flat- panel that appear visually seamless and optically uniform.</p> |
