| 摘要 |
PURPOSE: To prevent the short-circuit between repeating conductive layers, in a semiconductor device like a plastic molded LSI. CONSTITUTION: In a lead frame, the following are formed; a retaining part member 10, leads 12A, 12B, a wire repeating part 14 surrounding the part member 10, and tie bars 12a, 12b for holding the part member 10 and the repeating part 14. A repeating conductive layer is formed on a conductor plate isolated from the part member 10, via an insulating film. After an LSI chip is bonded to the part member 10, the lead 12A is connected with an electrode on the LSI chip 16 via bonding wires 18a, 18b and the repeating conductive layer. The lead 12B is similarly connected. After the part member 10, the tie bar 12a and the like, the lead 12A and the like, the repeating part 14, and the wire 18a and the like are molded and sealed with a resin body 20, unnecessary parts are cut and eliminated from the lead frame, and the lead 12A and the like are left. When the chip 16 is bonded, conductive adhesive agent does not flow as far as the repeating part 14. |
