| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermally fusible insulating sheet for electrically insulating between a printed wiring board and objects to be bonded, which exhibits a high heat resistance and a flowability suitable for bonding between the printed wiring board and the objects to be bonded when it is heated at a low temperature of 260 deg.C or less in a relatively short time. SOLUTION: The thermally fusible insulating sheet 2 is formed of a thermoplastic resin composite containing 65-35 wt.% of polyallylketone resin exhibiting 260 deg.C or higher of crystal fusion peek temperature and 35-65 wt.% of amorphous polyetherimide resin. The thermoplastic resin composite is a thermally fusible insulating sheet 2 exhibiting characteristics, such that the glass transfer temperature measured at the time of temperature rising by differential scanning calorimetry and the relation between the crystal fusion calorieΔHm and the crystallization calorieΔHc generated by crystallization during temperature rising is shown as the following formula (I): [(ΔHm-ΔHc)/ΔHm]<=0.5. |
