发明名称 |
A thinned semiconductor wafer and die and corresponding method |
摘要 |
A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities. |
申请公布号 |
AU2003268514(A8) |
申请公布日期 |
2004.03.29 |
申请号 |
AU20030268514 |
申请日期 |
2003.09.05 |
申请人 |
MOTOROLA, INC. |
发明人 |
KRISHNA KALYANASUNDARAM;PAUL BRAZIS;MARC CHASON;DANIEL GAMOTA |
分类号 |
H01L21/78;H01L;H01L21/301;H01L21/58;H01L21/68;H01L21/76;H01L23/538;H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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