| 摘要 |
PURPOSE: Provided is a photosensitive resin composition suitable for the use of an exposure light source of 160 nm or less, particularly F2 excimer laser light (157 nm), which shows sufficient transmission to the light source and has low line edge roughness and development time dependence. CONSTITUTION: The photosensitive resin composition comprises: (A) a resin which decomposes by the action of an acid to increase the solubility in an alkali developer, the resin comprising a repeating unit having a group represented by formula (Z), and a repeating unit having a group which is decomposed by the action of an acid to be transformed to an alkali soluble group; (B) a compound capable of generating an acid upon irradiation with an actinic ray or a radiation, the compound comprising at least two kinds of compounds selected from the group consisting of compounds capable of generating aliphatic or aromatic sulfonic or carboxylic acid substituted with at least one fluorine atom or containing no fluorine atom, upon irradiation with an actinic ray or a radiation; (C) a solvent; and (D) a surfactant: wherein R50 to R55 are the same or different, and each represents a hydrogen atom, a fluorine atom or an alkyl group optionally having a substituent, and at least one of R50 to R55 represents F, or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
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