| 发明名称 |
BOW CONTROL IN AN ELECTRONIC PACKAGE |
| 摘要 |
<p>A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a molding compound to attach the substrate to the package substrate.</p> |
| 申请公布号 |
SG102637(A1) |
申请公布日期 |
2004.03.26 |
| 申请号 |
SG20010005518 |
申请日期 |
2001.09.10 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
KUAN, LEE CHOON;CHAI, LEE KIAN |
| 分类号 |
H01L21/56;H01L23/00;H01L23/498;H05K3/30;H05K3/34;(IPC1-7):H01L23/14;H01L23/28 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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