| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for suppressing cracks in soldered joints between solder bumps of surface-mount components and electrode pads on a substrate due to a stress strain during the heat cycle in a flip-chip mounting method. <P>SOLUTION: A thermoplastic resin composition is added with a flux activity. An application film of the thermoplastic resin composition is formed on tops of the solder bumps in advance, and then a heat treatment is carried out in a reflow process. By this method, an oxide film of a metal material such as a solder material can be eliminated by the flux activity of the thermoplastic resin composition, and hence good-conditioned solder bonding can be performed. Thereafter, when cooled, the thermoplastic resin covering the periphery of the joints is solidified and becomes a resin coat/adhesive layer, exhibiting a crack suppressing effect to materialize more powerful solder bonding. <P>COPYRIGHT: (C)2004,JPO</p> |
