| 摘要 |
PROBLEM TO BE SOLVED: To provide a board packaging electronic apparatus in which high EMC (electromagnetic compatibility) can be ensured. SOLUTION: An earth bar 31 is provided as an earth line common to a plurality of connector units CU 1 substantially in the center in the arranging direction of a plurality of signal lines 38 arranged on a bus line board 33. The earth bar 31 is arranged substantially in parallel with the bus line board 33 in a slightly wide planar shape having a certain thickness and has electric resistance lower than that of the signal line 38. The area of a closed loop formed of the earth bar 31 and a signal line 38(1) or 38(r) farthest from the earth bar 31 is minimized thus retarding the transmission of noise by elecromagnetic induction. COPYRIGHT: (C)2004,JPO
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