发明名称 LAMINATE MATERIAL FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a laminate material for an electronic component having a fine and highly strong intermediate layer. SOLUTION: A laminate material constituted of at least three layers used as raw materials for an electronic component can be constituted of a plate material/an intermediate layer constituted of a single or a plurality of layers/plate material, and at least one layer of the intermediate layers can be constituted of a dry type deposited metal layer. A crystal particle dimension in the cross-sectional tissue of the dry type deposited metal layer can be set so as to be substantially 5μm or less. It is desired that the laminate material for the electronic component is configured so that the mean roughness of the joint interface of the plate material and the intermediate layer can be set so as to be substantially 1μm or less. It is more desired that the laminate material for an electronic component is configured so that the dry type deposited metal layer can be formed as a columnar crystal, and it is further desired that the laminate material for an electronic component is configured so that peeling strength can be set so as to range from 1kN/m or more. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004095763(A) 申请公布日期 2004.03.25
申请号 JP20020253417 申请日期 2002.08.30
申请人 HITACHI METALS LTD 发明人 TAKASHIMA HIROSHI
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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