VACUUM DEPOSITION MECHANISM

摘要

PROBLEM TO BE SOLVED: To provide a vacuum deposition system which can prevent the occurrence of variations in pressure and gas concentration by displacement drifts within a vacuum vessel 1, and can make the thin films formed on bodies for deposition homogeneous even in the individual bodies for deposition or with the bodies for deposition with each other by stabilizing the quality of deposition materials. SOLUTION: The vacuum deposition system forms the thin film by a mechanism 12 for generating the deposition materials disposed within the vacuum vessel 1 decompressed by an air displacement pump. Sidewalls 4A and 4B facing the interior of the vacuum vessel 1 are provided with a plurality of air outlets 4C communicatively connected with the air displacement pump in such a manner that the air outlets are arranged to be offset vertically and laterally. COPYRIGHT: (C)2004,JPO