发明名称 PHENOLIC RESIN MOLDING MATERIAL FOR COMMUTATOR
摘要 PROBLEM TO BE SOLVED: To provide a molding material for a commutator not generating cracks as compared with those of the conventional phenolic resin molding material comprising mainly glass fiber, even in a fusing process under severe treating conditions. SOLUTION: This phenolic resin material for the commutator characterized by containing the phenolic resin containing a resol type phenolic resin, silicone gel, an elastomer and an inorganic filler including glass fibers is provided with that preferably a part or the whole of the phenolic resin and the silicon gel are fused and mixed/kneaded in advance. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004091725(A) 申请公布日期 2004.03.25
申请号 JP20020257599 申请日期 2002.09.03
申请人 SUMITOMO BAKELITE CO LTD 发明人 NISHIMURA MASAO
分类号 C08L61/08;C08K3/26;C08K3/34;C08K7/14;C08L21/00;C08L83/04;H02K13/00;(IPC1-7):C08L61/08 主分类号 C08L61/08
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