发明名称 |
Electrical connection through nonmetal |
摘要 |
A low resistance path extends from a first region of a semiconductor substrate to a second region thereof. The low resistance path is produced by depositing a metal such as aluminum on the surface of the substrate and then directing a laser beam onto the metal causing the metal and a portion of the substrate beneath the metal to melt forming an alloy of the metal and the substrate material.
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申请公布号 |
US2004056350(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20020253555 |
申请日期 |
2002.09.24 |
申请人 |
MEDTRONIC, INC. |
发明人 |
RUBEN DAVID A. |
分类号 |
H01L21/768;H01L23/48;(IPC1-7):H01L21/44;H01L23/52;H01L29/40;H01L21/477 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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