发明名称 Electrical connection through nonmetal
摘要 A low resistance path extends from a first region of a semiconductor substrate to a second region thereof. The low resistance path is produced by depositing a metal such as aluminum on the surface of the substrate and then directing a laser beam onto the metal causing the metal and a portion of the substrate beneath the metal to melt forming an alloy of the metal and the substrate material.
申请公布号 US2004056350(A1) 申请公布日期 2004.03.25
申请号 US20020253555 申请日期 2002.09.24
申请人 MEDTRONIC, INC. 发明人 RUBEN DAVID A.
分类号 H01L21/768;H01L23/48;(IPC1-7):H01L21/44;H01L23/52;H01L29/40;H01L21/477 主分类号 H01L21/768
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