Substrate processing apparatus and substrate processing system

摘要

Of a substrate-facing surface 24 of an atmosphere blocking member 2, a central area 241 which is faced with an approximately central portion of a substrate S is a flat surface while a periphery edge area 242 which is faced with a periphery edge of the substrate S is an angled surface which becomes closer to the substrate S with a distance toward a periphery edge of the substrate-facing surface 24. Hence, a micro-space SP between the substrate S and the atmosphere blocking member 2 becomes gradually narrower in a direction R which is toward the periphery edge of the substrate S. As an atmosphere gas is fed into the micro-space SP, the atmosphere gas is compressed in the vicinity of a periphery edge of the micro-space SP and a pressure rises. As a result, the micro-space SP becomes positively pressurized as compared with a mist-splashed atmosphere, which effectively prevents a mist from invading other major surface S2 of the substrate S.