Plating apparatus and plating method

摘要

A plating apparatus for performing a plating process for plating a surface of a substrate. This plating apparatus is provided with a first electrode to be brought into contact with a peripheral edge portion of the substrate; a plating vessel for containing a plating liquid to be brought into contact with the surface of the substrate, the plating vessel having a vertical tubular interior surface; a second electrode disposed in the plating vessel, the second electrode being spaced from the substrate by a distance which is not smaller than a distance between a center portion and a peripheral edge portion of the substrate during the plating process; and an electric current limiting member for limiting horizontal flow of an electric current in the plating liquid between the second electrode and the substrate within the plating vessel during the plating process.