| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board for stably forming a fine circuit pattern with high accuracy and a high production yield. SOLUTION: The method for manufacturing the printed wiring board has a blackening step of blackening the surface of a conductive layer provided on an insulating substrate; a photolithography step of laminating a dry film on the blackened surface, and exposing and developing the dry film; and an etching step of etching the conductive layer exposed by the photolithography step to form the circuit pattern. Further, if a re-exposing step of re-exposing is conducted between the photolithography step and the etching step, the blackening step may be omitted. COPYRIGHT: (C)2004,JPO
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