| 摘要 |
A device, such as an optoelectronic device, including a submount and a cover, and a method of manufacture of such a device. The submount includes a substrate with a groove formed in the substrate. The substrate further includes at least one cavity formed in the substrate displaced from but in sufficiently close proximity to the groove so that a controlled amount of liquid adhesive, such as epoxy, in the cavity wicks into the groove when the cover is placed over the cavity and groove.
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