| 摘要 |
PROBLEM TO BE SOLVED: To provide a remover composition and a washing method of semiconductor substrates or semiconductor elements using the remover composition which can prevent re-sticking of a deposit with being obtainable an excellent removing property of the deposit produced after ashing, can obtain a stable property and state and a stable removing property with little corrosive to a wiring material, no precipitation formed by crystallization even in low-temperature preservation, nor deterioration or the like in the removing property resulting from it. SOLUTION: The remover composition contains 0.5 to 5 wt% of polycarboxylate, 1 to 18 wt% of glycol ether, and 77 to 98.5 wt% of water. The remover composition is composed of 0.5 to 5 wt% of polycarboxylate, 1 to 18 wt% of glycol ether, and 77 to 98.5 wt% of water. The washing method of semiconductor substrates or semiconductor elements has a process for removing and washing the semiconductor substrate or the semiconductor element using the remover composition. COPYRIGHT: (C)2004,JPO |
