发明名称 Method for precise molding and alignment of structures on a substrate using a stretchable mold
摘要 A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
申请公布号 US2004058614(A1) 申请公布日期 2004.03.25
申请号 US20030626285 申请日期 2003.07.24
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 CHIU RAYMOND C.;HOOPMAN TIMOTHY LEE;HUMPAL PAUL EDWARD;KING VINCENT WEN-SHIUAN;DILLON KENNETH R.
分类号 H01J9/02;B29C33/30;B29C33/40;B29C33/42;H01J9/24;H01J11/02;H01L21/027;(IPC1-7):H01J9/24 主分类号 H01J9/02
代理机构 代理人
主权项
地址