| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for capable of realizing the reduction of an adhesive power by an easy work. SOLUTION: This method for reducing the adhesive power is provided by irradiating a high energy beam to an adhesive consisting mainly of a resin obtained by polymerizing a (meth)acrylic acid or (meth)acrylic acid ester with at least one a polymerizabele monomer, and heating or cooling after the irradiation to reduce the adhesive power. Also, an adhesive structural material is dismembered by heating or cooling while irradiating the high energy radiation or after the irradiation on the adhered structural material adhered by a both sides adhesive tape. COPYRIGHT: (C)2004,JPO
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