Computer controlled de-clip-shadow mask removal machine

摘要

Computer controlled de-clip-shadow mask removal machine. The present disclosure describes a computer controlled, fully programmable de-clip-shadow mask removal method and system. This method and system is adapted to remove retaining clips (without human contact), separate a shadow mask from a semiconductor wafer after a metal evaporation process, and remove the shadow mask with greater accuracy. The system uses servomotors which precisely control all ranges of motion required to safely and efficiently remove the mask from the wafer thus minimizing potential damages incurred by human contact.