| 摘要 |
<p>A radiation sensitive resin composition for forming a thick film resist pattern comprises an alkali-soluble resin and a photosensitizer containing a quinone diazide group, wherein the alkali-soluble resin is a mixture of a novolak resin and one or more resins selected from the group consisting of (i) a polyacrylate, (ii) a polymethacrylate, (iii) a polystyrene derivative, and (iv) a copolymer comprising two or more monomer units selected from the group of an acrylate, a methacrylate and a styrene derivative. The composition is applied on a substrate to form a 2.0 mu m or more of resist film in thickness. The resist film is exposed to light and developed to form a thick film resist pattern. The radiation sensitive resin composition may contain a low-molecular or high-molecular compound having phenolic hydroxyl group or groups as a dissolution promoter or a sensitivity improving agent, a fluorescent material as a sensitizer, etc. <IMAGE></p> |
