发明名称 |
COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER |
摘要 |
A lead-free solder (130) comprises an alloy that includes Ag in an amount of 2 wt % to 18 wt %, Bi in an amount of 98 wt % to 82 wt %, and a third element in an amount of 0.1 wt % to 5.0 wt %. The third element is selected from the group consisting of Au, Cu, Pt, Sb, Zn, In, Sn, Ni and Ge. Contemplated alloys have a solidus of no lower than 230°C and a liquidus of no higher than 400°C. |
申请公布号 |
EP1399600(A1) |
申请公布日期 |
2004.03.24 |
申请号 |
EP20010948248 |
申请日期 |
2001.05.28 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
LALENA, JOHN;DEAN, NANCY;WEISER, MARTIN |
分类号 |
B23K35/00;B23K35/26;C22C5/02;C22C12/00;C22C13/00;C22C13/02;H01L21/60 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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