Optical device-related adhesive and optical device

摘要

An adhesive in the form of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) 20 to 90% by weight based on the entire composition of an inorganic filler having an average particle size from more than 1 mum to 20 mum and containing up to 1% by weight of a fraction of particles having a particle size of at least 45 mum and optionally, (C) a silicone-modified resin is suitable for bonding optical elements in optical devices.