METHOD FOR PLATING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method is provided to achieve improved quality of the printed circuit board by removing unnecessary metal layers from the printed circuit board after formation of the plating layer. CONSTITUTION: A method comprises a step of depositing a photoresist(50) on the portion of a substrate excluding connection pads and power connection portions(45,45'); a step of forming an electrolytic layer(60) on the surface of the substrate where the connection pads are arranged; a step of masking the electrolytic layer with a plating resistant resist; a step of forming a plating layer on the connection pads on the surface of the substrate where the electrolytic layer is formed, by supplying a power to the electrolytic layer; and a step of removing the plating resistant resist and the electrolytic layer.