发明名称 PROBE TEST HEAD STRUCTURE OF PROBE CARD
摘要 PROBLEM TO BE SOLVED: To solve a conventional problem wherein the kinds of probe cards corresponding to all types of LSI's are required and productivity and maintainability thereof are poor with a background that the number of the all types of test object LSI's is determined by the combination between arrangement of each signal terminal and arrangement of a power supply terminal and a grounding terminal. SOLUTION: This probe card is constituted by fixing a probe pin 12 on a support substrate 11 of a probe head 10. The probe pin is equipped with a power supply substrate 20 for imparting the voltage of a power supply or grounding. A through-hole 21 is bored on the same position as a pin 12 array on the power supply substrate 20, and a pad of the LSI 30 is in contact with the pin 12 through the through-hole. Power supply pads 23 are formed respectively on the laminated power supply substrates 20, and the power is supplied to the probe head 10 by bringing a power supply probe pin 13 into contact with the pad 23. When piling the power supply substrates 20, a larger substrate 20 is laminated on the lower side in the order of size, so that the pads 23 are exposed to the outside. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004085281(A) 申请公布日期 2004.03.18
申请号 JP20020244439 申请日期 2002.08.26
申请人 NEC ENGINEERING LTD 发明人 CHIKAMA HIROKI
分类号 G01R31/26;G01R1/06;G01R1/073;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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