发明名称 |
SUBSTRATE WITH CONDUCTOR LAYER AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate having a conductor layer used for a printed circuit board which is excellent in a tracking-resistance characteristic without spoiling an electrical insulation, and its manufacturing method. SOLUTION: The substrate with conductor layer comprises the conductor layer and an insulation layer superposed on the conductor layer through the film made by hardening an adhesive. The adhesive is blended with bridged acrylonitrile butadiene rubber particles at the time of applying. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004082737(A) |
申请公布日期 |
2004.03.18 |
申请号 |
JP20030321306 |
申请日期 |
2003.09.12 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TOSAKA YUJI;TAKANEZAWA SHIN;IRINO TETSURO |
分类号 |
B32B15/08;B32B7/12;B32B25/16;H05K3/38;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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地址 |
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