发明名称 SUBSTRATE WITH CONDUCTOR LAYER AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate having a conductor layer used for a printed circuit board which is excellent in a tracking-resistance characteristic without spoiling an electrical insulation, and its manufacturing method. SOLUTION: The substrate with conductor layer comprises the conductor layer and an insulation layer superposed on the conductor layer through the film made by hardening an adhesive. The adhesive is blended with bridged acrylonitrile butadiene rubber particles at the time of applying. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004082737(A) 申请公布日期 2004.03.18
申请号 JP20030321306 申请日期 2003.09.12
申请人 HITACHI CHEM CO LTD 发明人 TOSAKA YUJI;TAKANEZAWA SHIN;IRINO TETSURO
分类号 B32B15/08;B32B7/12;B32B25/16;H05K3/38;(IPC1-7):B32B15/08 主分类号 B32B15/08
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